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Manufacturer Part #
MCP6273T-E/CH
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3000 per Reel
SOT-23-6 (SOT-26)
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for MCP603T-E/CH, MCP603T-I/CH, MCP6043T-E/CH, MCP6043T-I/CH, MCP6143T-E/CH, MCP6273T-E/CH, MCP6283T-E/CH and MCP6293T-E/CH catalog part numbers (CPN) available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change:The following is the list of modifications:1. Updated ?Package Types?.2. Updated Section 2.0 ?Typical Performance Curves?.3. Updated Figure 4-4.4. Updated Section 6.2 ?Package Drawings?.5. Updated ?Product Identification System?.6. Added ?Product Identification System (Automotive)?.Reason for Change: To improve productivity.Data Sheet Link: https://www.microchip.com/mymicrochip/filehandler.aspx?documentid=051c43c7-ab9e-48a0-bd37-5bf392c814a8
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
The MCP6273T-E/CH is a Rail-to-Rail Input/Output CMOS Op Amp with wide gain bandwidth product of 2 MHz and a 65° phase margin for the quiescent curret of 170 µA, available in SOT-23-6 surface mount package.
Features:
Applications:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
