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Manufacturer Part #
MCP6273T-E/CH
SINGLE 2 MHZ OP W/ CS, E TEMP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-6 (SOT-26) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2337 | ||||||||||
Microchip MCP6273T-E/CH - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for MCP603T-E/CH, MCP603T-I/CH, MCP6043T-E/CH, MCP6043T-I/CH, MCP6143T-E/CH, MCP6273T-E/CH, MCP6283T-E/CH and MCP6293T-E/CH catalog part numbers (CPN) available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for MCP603T-E/CH, MCP603T-I/CH, MCP6043T-E/CH, MCP6043T-I/CH, MCP6143T-E/CH, MCP6273T-E/CH, MCP6283T-E/CH and MCP6293T-E/CH catalog part numbers (CPN) available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change:The following is the list of modifications:1. Updated “Package Types”.2. Updated Section 2.0 “Typical Performance Curves”.3. Updated Figure 4-4.4. Updated Section 6.2 “Package Drawings”.5. Updated “Product Identification System”.6. Added “Product Identification System (Automotive)”.Reason for Change: To improve productivity.Data Sheet Link: https://www.microchip.com/mymicrochip/filehandler.aspx?documentid=051c43c7-ab9e-48a0-bd37-5bf392c814a8
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
Microchip MCP6273T-E/CH - Technical Attributes
| Amplifier Type: | General Purpose |
| No of Channels: | 1 |
| Slew Rate-Nom: | 0.9V/µs |
| Input Offset Voltage-Max: | 3mV |
| Gain Bandwidth Product: | 2MHz |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 2V to 6V |
| Common Mode Rejection Ratio: | 85dB |
| Supply Current: | 170µA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 90dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 110dB |
| Phase Margin: | 65° |
| Low Noise: | 20nV/√Hz |
| Output Current: | 25mA |
| Package Style: | SOT-23-6 (SOT-26) |
| Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-6 (SOT-26)
Mounting Method:
Surface Mount