Référence fabricant
MIC47100-1.2YML-TR
1A HIGH SPEED, LOW VIN LDO
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Std. Mfr. Pkg Style d'emballage :MLF-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC47100-1.2YML-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
***UPDATE OF PCN112600 & PCN112910***Description of Change: Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8L VDFN (2x2x0.9mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.Estimated First Ship Date: 18 July 2025 (date code: 2529)Revision History: April 29, 2025: Issued initial notification.May 14, 2025: Re-issued initial notification to update the dimensions of the T/R antistatic shield bag of UNIG from inches to mm for both length and width and mils to mm for thickness.July 02, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on July 18, 2025.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
******FPCN112600 UPDATE******Description of Change: Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8LVDFN(2x2x0.9mm).***Re-issued initial notification to update the dimensions of the T/R antistatic shield bag of UNIG from inches to mm for both length and width and mils to mm for thickness***Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.
Description of Change: Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8L VDFN (2x2x0.9mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Statut du produit:
Microchip MIC47100-1.2YML-TR - Caractéristiques techniques
| Input Voltage-Min: | 1V |
| Input Voltage-Max: | 3.6V |
| Output Voltage Fixed: | 1.2V |
| Dropout Voltage-Max: | 80mV |
| Output Current-Max: | 1A |
| Style d'emballage : | MLF-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MIC47100-1.2YML TR is a high speed, Low V IN LDO capable of delivering up to 1 A and designed to take advantage of point of load applications that use multiple supply rails to generate a low voltage, high current power supply. The MIC47100 is stable with only a 1 µF ceramic output capacitor and is available in a thermally enhanced 2 mm × 2 mm MLF ® package thus making it an optimal solution for board-constrained applications.
The MIC47100 has an NMOS output stage offering very low output impedance. The NMOS output stage offers a unique ability to respond very quickly to sudden load changes such as that required by a microprocessor, DSP or FPGA. The MIC47100 consumes little quiescent current and therefore can be used for driving the core voltages of mobile processors, post regulating a core DC/DC converter in any portable device.
The MIC47100 is available in fixed and adjustable output voltages in the exposed pad MSOP-8 package and the tiny 2 mm × 2 mm MLF ® package with an operating junction temperature range of -40 °C to +125 °C.
Key Features:
- Operating voltage range:
- Input Supply: 1.0 V to 3.6 V
- Bias Supply: 2.3 V to 5.5 V
- 0.8 V to 2.0 V output voltage range
- High bandwidth – very fast transient response
- PSRR >50 dB at 100 kHz
- Stable with a 1 µF ceramic output capacitor
- Low dropout voltage of 80 mV at 1 A
- High output voltage accuracy:
- +/- 1.5% initial accuracy
- +/- 2% over temperature
- Logic level enable input
- UVLO on both supply voltages for easy turn-on
- ePad MSOP-8 – small form factor power package
- Thermally enhanced 2 mm × 2 mm MLF ® – smallest solution
Applications:
- Point of Load
- PDAs
- DSP, PLD and FPGA Power Supply
- Low Voltage Post Regulation
To learn more about the MIC47100 product family, Click Here
Emballages disponibles
Qté d'emballage(s) :
5000 par Std. Mfr. Pkg
Style d'emballage :
MLF-8
Méthode de montage :
Surface Mount