Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
TC1270ANRVRCTR
Tèlèchargez les modèles CAD pour ce produit. En savoir plus sur SnapMagic.
3000 par Reel
SOT-143 (TO-253-4)
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Product Category: Power Management - System Supervisors/Voltage DetectorsDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, 84-3J as new die attach material and G700LTD as new mold compound material for selected TC1270A, TC1271A and TC1270AN device families available in 4L SOT-143 package.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, 84-3J as new die attach material and G700LTD as new mold compound material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: January 2027
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Final Notice: Qualification of 2025DSI epoxy die attach for the 4L SOT-143 package at MMS (ATES) assembly site. Pre Change: 84-1 LMISR4 conductive epoxy die attachPost Change: 2025DSI non-conductive epoxy die attach
Statut du produit:
Sur commande
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
