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MCP2515T-E/ST
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2500 per Reel
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*** Update of FPCN 119207 ***Revision History: February 06, 2026: Issued initial notification. August 26, 2026: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2026.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 558-2C31 as a new die attach material for MCP2515-E/ST, MCP2515E/STRB2, MCP2515-E/STRB4, MCP2515-I/ST, MCP2515-I/STRB2, MCP2515-I/STRB4, MCP2515T-E/ST, MCP2515T-E/STRB2, MCP2515T-E/STRB4, MCP2515T-I/ST, MCP2515TI/STRB2 and MCP2515T-I/STRB4 catalog part numbers (CPN) available in 20L TSSOP (4.4mm) package at NSEB assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 558-2C31 as a new die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: 30 September 2026 (date code: 2640)
*** Update of FPCN 118923 ***Revision History: February 02, 2026: Issued initial notification.June 30, 2026: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on November 30, 2026. Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, MC27 as a new mold compound material, and EP27 as a new die attach material for MCP2515T-I/STRB4, MCP2515T-E/STRB2, MCP2515-I/STRB2, MCP2515-E/STRB4, MCP2515TE/ST, MCP2515-E/ST, MCP2515-E/STRB2, MCP2515T-I/STRB2, MCP2515T-I/ST, MCP2515I/STRB4, MCP2515T-E/STRB4, MCP2515-I/ST, MCP2515-E/STVAO, MCP2515T-E/STVAO, MCP2515-I/STVAO, and MCP2515T-I/STVAO catalog part numbers (CPN) available in 20L TSSOP (4.4mm) packages at ANAP assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, MC27 as a new mold compound material, and EP27 as a new die attach material standardize the use of PFAS free material at ANAP assembly site.Estimated First Ship Date: 30 November 2026 (date code: 2649)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 558-2C31 as a new die attach material for MCP2515-E/ST, MCP2515-E/STRB2, MCP2515-E/STRB4, MCP2515-I/ST, MCP2515-I/STRB2, MCP2515-I/STRB4, MCP2515T-E/ST, MCP2515T-E/STRB2, MCP2515T-E/STRB4, MCP2515T-I/ST, MCP2515T-I/STRB2 and MCP2515T-I/STRB4 catalog part numbers (CPN) available in 20L TSSOP (4.4mm) package at NSEB assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 558-2C31 as a new die attach materialEstimated Qualification Completion Date: July 2026
Product Category: CAN ControllerDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, MC27 as a new mold compound material, and EP27 as a new die attach material for MCP2515T-I/STRB4, MCP2515T-E/STRB2, MCP2515-I/STRB2, MCP2515E/STRB4, MCP2515T E/ST, MCP2515-E/ST, MCP2515-E/STRB2, MCP2515T-I/STRB2, MCP2515T-I/ST, MCP2515-I/STRB4, MCP2515T-E/STRB4, MCP2515-I/ST, MCP2515-E/STVAO, MCP2515T-E/STVAO, MCP2515-I/STVAO, and MCP2515T-I/STVAOcatalog part numbers (CPN) available in 20L TSSOP (4.4mm) packages at ANAP assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, MC27 as a new mold compound material, and EP27 as a new die attach material standardize the use of PFAS free material at ANAP assembly site.Estimated Qualification Completion Date: October 2026
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
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