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Manufacturer Part #
MCP2515T-E/ST
Stand-Alone CAN Controller With SPI Interface. TSSOP20
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| Mfr. Name: | Microchip | ||||||||||
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Product Variant Information section
Available PackagingPackage Qty:2500 per Reel |
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Microchip MCP2515T-E/ST - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 558-2C31 as a new die attach material for MCP2515-E/ST, MCP2515-E/STRB2, MCP2515-E/STRB4, MCP2515-I/ST, MCP2515-I/STRB2, MCP2515-I/STRB4, MCP2515T-E/ST, MCP2515T-E/STRB2, MCP2515T-E/STRB4, MCP2515T-I/ST, MCP2515T-I/STRB2 and MCP2515T-I/STRB4 catalog part numbers (CPN) available in 20L TSSOP (4.4mm) package at NSEB assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 558-2C31 as a new die attach materialEstimated Qualification Completion Date: July 2026
Product Category: CAN ControllerDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, MC27 as a new mold compound material, and EP27 as a new die attach material for MCP2515T-I/STRB4, MCP2515T-E/STRB2, MCP2515-I/STRB2, MCP2515E/STRB4, MCP2515T E/ST, MCP2515-E/ST, MCP2515-E/STRB2, MCP2515T-I/STRB2, MCP2515T-I/ST, MCP2515-I/STRB4, MCP2515T-E/STRB4, MCP2515-I/ST, MCP2515-E/STVAO, MCP2515T-E/STVAO, MCP2515-I/STVAO, and MCP2515T-I/STVAOcatalog part numbers (CPN) available in 20L TSSOP (4.4mm) packages at ANAP assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, MC27 as a new mold compound material, and EP27 as a new die attach material standardize the use of PFAS free material at ANAP assembly site.Estimated Qualification Completion Date: October 2026
Part Status:
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Available Packaging
Package Qty:
2500 per Reel