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Manufacturer Part #
R5F109AAJSP#X0
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2500 per Reel
SSOP-30
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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Description of Change:Applicable Assembly Factory: Renesas Semiconductor KL Sdn. Bhd. The Bonding wire material will be changed to copper. Reason for Change:For stable supply of products
Description of Change: Applicable Assembly Factory: Renesas Semiconductor KL Sdn. Bhd. The Bonding wire material will be changed to copper. The following materials are also changed according to the bonding wire change. See below for details.1 Bonding wire material change 2 Lead frame change3 Die attach material change4 Mold resin material change5 Exterior plating material specification change6 Package outlineReason for Change: For stable supply of productsEffective Date: 5/16/2025Sample Availability Date: 4/21/2025
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
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