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Manufacturer Part #
24AA128-I/MF
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:60 per Std. Mfr. Pkg | ||||||||||
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Microchip 24AA128-I/MF - Product Specification
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Description of Change: Qualification of MMT as an additional assembly site for selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families available in 8L DFN-S (6x5x0.9mm) package.Reason for Change: To improve on-time delivery and manufacturability performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date: May 2026
Description of Change: Qualification of 558-2C31 as a new die attach material for selected 24AA512, 24LC512, 24FC512, 24FC64, 24AA128, 24LC128, 24FC128, 24AA256, 24LC256 and 24FC256 device families available in 8L DFN-S (6x5x0.9mm) package at NSEB assembly site.Reason for Change: To improve manufacturability by qualifying 558-2C31 as a new die attach to standardize the use of PFAS free material.
Description of Change:Qualification of U08D as a new fabrication location for selected AT24C128C, 24LC128, 24FC128, and 24AA128 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date:27 March 2025 (date code: 2513)Revision History:January 18, 2025: Issued initial notification.February 19, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be March 27, 2025.
Description of Change:Qualification of U08D as a new fabrication location for selected AT24C128C, 24LC128, 24FC128, and 24AA128 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
CCB 1474 Initial Notice: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Description of Change: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Pre Change: EFTEC-64T lead-framePost Change: EFTEC-64T or C194 lead-frameReason for Change: To improve on-time delivery performance by qualifying an additional lead frame materialNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=24AA128-I/MF&field4=Microchip&field18=https://p1na.futureelectronics.com/p/24aa128-i-mf-C016257343
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=24AA128-I/MF&field4=Microchip&field18=https://p1na.futureelectronics.com/p/24aa128-i-mf-C016257343
Available Packaging
Package Qty:
60 per Std. Mfr. Pkg