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Manufacturer Part #
FD1840013
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1000 per Reel
Surface Mount
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ECCN:
PCN Information:
Change Type:Change of Die-Attach Adhesive (PFAScontaining to PFAS-Free) Under the MPU DIE of Select Crystal OscillatorsTitle:Change of the Die Attach (PFAS-containing to a PFAS-free) Adhesive under the MPU Die of Select Crystal Oscillators (XOs) DESCRIPTION OF CHANGE This PCN is being issued to notify customers that Diodes is making a change in the die attach (DA) adhesive being used under the microprocessor (MPU) die of crystal oscillators (XOs) manufactured by Diodes. The current DA used under the MPU die contains PFAS, a substance known to pose significant risks to humans and the environment. This DA is being replaced by PFAS-free LOCTITE? ABLESTIK ABP 2025DNP. The XOs in this PCN are manufactured in Diodes internal AT site (PCL) in Taoyuan City, Taiwan. Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure there is no change to device functionality or electrical specifications in the datasheet. There will be no change to Form, Fit or Function of products affected. Implementation Date: October 1, 2026
This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified additional Bill of Material (BOM), Die Source (SK Key Foundry) located in Cheongju, Korea.Diodes has also qualified an additional Bill of Materials (BOM), Die Revision on select products.Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure no change to device functionality or electrical specifications in the datasheet.Table 1 - Additional Bill Of Material (BOM) - Die SourceTable 2 - Additional Bill Of Material (BOM) - Die Revision (Metal Only)
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
