Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
BSC040N10NS5ATMA1
Download the CAD models for this product. Learn more about SnapMagic.
5000 per Reel
TDSON-8
Surface Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Subject : Change of gate wire material to copper wire for dedicated OptiMOS™ products in PG-TDSON-8 packageDescription :Old Wire bond material Gold (Au)New Wire bond material Copper (Cu) Reason: Copper wire bonding is part of Infineon’s continuous drive to deliver higher performance products. A copper wire enables superior electrical, thermal and reliability performance compared to gold, making it an excellent interconnect solution for industrial packagingIntended start of delivery 2026-10-30 or earlier, depending on customer approval
Detailed change informationSubject Extension of shelf lifetime from 3 to 5 years for products in SMD (Surface Mount Devices) and Leadless packagesReason Extension of shelf lifetime and product availabilityDescription Maximum storage timeOld - 3 years New- 5 yearsIntended start of delivery Immediately
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.