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MIC4690YM-TR
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2500 per Reel
SOIC-8
Surface Mount
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Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
***UPDATE OF PCN110834***Description of Change: CCB 7364.004 Final Notice: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected LM4040, LM4041, MIC23158, MIC23159, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC4043, MIC4680, MIC4681, MIC4682, MIC4684, MIC4685, MIC4690, MIC5201, MIC5203, MIC5205, MIC5206, MIC5207, MIC5208, MIC5209, MIC5210, MIC5211, MIC5212, MIC5213, MIC5216, MIC5219, MIC5234, MIC5236, MIC5237, MIC5238, MIC5239, MIC5270, MIC5271, MIC6211, MIC6270, MIC79050, MM5450 and MM5451 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Revision History:March 31, 2023: Issued initial notification.August 30, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2023.Description of Change:Qualification of 2200D as a new die attach material for selected MIC371xx, MIC391xx, MIC468xx and MIC469xx device families available in 8L SOIC (3.9mm) package.Reason for Change:To improve manufacturability by qualifying 2200D as a new Die Attach material.
PCN Status:Initial NotificationDescription of Change:Qualification of 2200D as a new die attach material for selected MIC371xx, MIC391xx, MIC468xx and MIC469xx device families available in 8L SOIC (3.9mm) package.Reason for Change:To improve manufacturability by qualifying 2200D as a new Die Attach material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2023
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