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Manufacturer Part #
25LC1024-E/SM
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90 per Tube
SOIJ-8
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Description of Change:Qualification of U08D as an additional fabrication site using 66.91K process technology for selected products of AT25M01, 25LC1024 and 25AA1024 device families available in 8L SOIC (.150in) , SOIJ (.208in), PDIP (.300in) and DFN-S (6x5x0.9mm) packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as an additional fabrication site using 66.91K process technology.
Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
Description of Change: Qualification of 66.9k wafer technology with QMI519 as a new die attach material and Au as a new wire material for selected 25AA1024, 25LC1024 and AT25M01 device families available in 8L SOIJ (.208in) package.Reason for Change: To improve manufacturability by qualifying 66.9k wafer technology with QMI519 as a new die attach material and Au as a new wire material.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
