Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
MX25L25645GXDI-08G
Download the CAD models for this product. Learn more about SnapMagic.
480 per Tray
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Subject: Change die attach material for ChipMOS 24CSP package products.Change Category : Assembly material Description:Before Change : Die attach material (w/ PFAS):Epoxy (Henkel, 2025D)After Change :Die attach material (PFAS-Free):Film (Nitto, EM-760Reason of Change:The State of Maine in the United States issued a written notification (H.P.1113-L.D.1503) prohibit intentional addition of PFAS(Perfluoroalkyl and Polyfluoroalkyl Substances) material in all consumer products starting from Jan. 2030.Schedule:New material sample available date: Jan. 9, 20261st shipping date: May 4, 2026 (Or follow PCN agreement with the customer)(Note: An overlap period using both old and new materials is expected until the old stock is depleted.)
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.