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Manufacturer Part #
2EDL23N06PJXUMA1
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2500 per Reel
SOIC-14
Surface Mount
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Subject: Standardization of packing orientation for products in PG-DSO-14. Description:Old:Carsem (M) Sdn.Bhd. and JCET Co., Ltd D8 with Packing Orientation Upper Left Hana Semiconductor (Ayutthaya) Co., Ltd with Packing Orientation Bottom Right New:Carsem (M) Sdn.Bhd., JCET Co., Ltd D8, and Hana Semiconductor (Ayutthaya) Co. with Packing Orientation Upper Left Reason: Relocation of the PIN-1 to the upper left position at Hana Semiconductor (Ayutthaya) Co., Ltd site to standardize packing orientation for PG-DSO-14 across all sites. Intended start of delivery: 15.05.2026
Description:Old Assembly and test location: Carsem (M) Sdn.Bhd.Assembly and test location: JCET Co., Ltd D8NewAssembly and test location: Carsem (M) Sdn.Bhd.Assembly and test location: JCET Co., Ltd D8Assembly and test location: Hana Semiconductor (Ayutthaya) Co., LtdReason: Expansion of assembly production and final test to assure continuity of supply and enable flexible manufacturing.Intended start of delivery 2025-09-14
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.