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Manufacturer Part #
IKCM10L60GAXKMA1
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14 per Tube
MDIP-24
Through Hole
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Subject:Extension of shelf lifetime from 3 to 5 years for certain SMD (surface mount devices), THD (through hole devices) and IPM (intelligent power modules) products. Description:Old3 yearsNew 5 years Reason:Extension of shelf lifetime and product availability.
Subject: Introduction of an additional wafer production location at Infineon Technologies Dresden GmbH, Dresden, Germany and change of wafer size from 200mm to 300mm for IGBT3 600V. Description Old :Production Site - Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia New:- Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia and - Infineon Technologies Dresden GmbH & Co. KG, Dresden, Germany Wafer diameter - 200mm - 200mm and 300mm Reason: Expansion of wafer production to assure continuity of supply and enable flexible manufacturing.
***CANCELLATION OF PCN95984***The PCN N? 2022-094-A, dated 2023-02-16 has been cancelled.
Subject Barcode Product Label (BPL) and lot number harmonization.DescriptionOld(1T) Lot number format: 8 digits starting with 2Z (both on device and BPL)Barcode Product Label: (X) showing Infineon internal number. New:(1T) Lot number format: 11 digits starting with 2Z (both on device and BPL)Barcode Product Label: (3P) Infineon manufacturing identifier as shown in delivery notesContent of (X) / (3P) and (1T) included both in the long and 2D barcode. Reason Harmonize and standardize the lot number format and the BPL across all external production partners.Intended start of delivery 2026-02-01
Detailed change information Subject: Introduction of an additional assembly location at Infineon Technologies Co., Ltd., Wuxi, China for CIPOS?mini products Reason: Expansion of assembly production to assure continuity of supply and enable flexible manufacturing.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
