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Manufacturer Part #
HV9110NG-G
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53 per Tube
SOIC-14
Surface Mount
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PCN Information:
*** Update of FPCN 111834 - Location and Material Change ***Revision History: March 25, 2025: Issued initial notification.March 27, 2026: Issued final notification. Attached the Qualification Report. Provided the Estimated First Ship date to be on April 30, 2026.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for the selected CL8800, CL8801, HV9110, HV9112, HV9113, HV9120, HV9123, HV9901, HV9910, HV9910B, HV9911, HV9921, HV9922, HV9923, HV9930, HV9931, HV9961, LR645, LR745 and LR8 device families of BIC8 800V (6TK, 6SK, 68K, 66K) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 April 2026 (date code: 2618)
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for the selected CL8800, CL8801, HV9110, HV9112, HV9113, HV9120, HV9123, HV9901, HV9910, HV9910B, HV9911, HV9921, HV9922, HV9923, HV9930, HV9931, HV9961, LR645, LR745 and LR8 device families of BIC8 800V (6TK, 6SK, 68K, 66K) technology available in various packages.Pre and Post Summary Changes: See attached documentImpacts to Datasheet:NoneChange Impact:NoneReason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status: In ProgressEstimated Qualification Completion Date: November 2025Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Timetable Summary: See attached documentMethod to Identify Change: Traceability CodeRevision History:March 25, 2025: Issued initial notification.
Description of Change:Microchip has released a new Datasheet for the HV911X Family Data Sheet of devices. If you are using one of these devices please read the document located at HV911X.? Updated section Features.? Updated Functional Block Diagram for HV9110/HV9112 and Functional Block Diagram for HV9113.? Updated package drawing in section Packaging Information.Reason for Change: To Improve Productivity
Final Notice - Additional Fabrication Site: Qualification of an additional fabrication site for certain Supertex devices.Qualification of an additional fabrication site for HT0440, HT0740, HV9110, HV9112, HV9113, HV9120, HV9123, LR645, LR745 and LR8 Supertex device families.Pre Change: Fabricated at SPTX fab site.Post Change: Fabricated at Microchip FAB2 fab site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
