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Manufacturer Part #
R5F51115AGFL#3A
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250 per Tray
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Description of Change:Die-bonding and resin materials will be changed for assembly location RSB (Renesas Semiconductor (Beijing) Co., Ltd).Reason for Change:The new materials are already proven and used for other products in RSB assembly.No samples planned because the changed materials are already well known and used in mass production for other products.To ensure stable supply
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.