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Manufacturer Part #
R5F563NADDBG#U0
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152 per Tray
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PCN Information:
****FPCN122502 DOCUMENT UPDATE:LOCATION AND TESTING CHANGE/ FROM PC-MCU-A048A/E TO PC-MCU-A048B/E ****Subject: Transfer of the Final Test, Visual Inspection and Packing production line for MCU products Description of Change: The Final Test, Visual Inspection and Packing production line for the affected MCU products will be transferred from Oita and Yonezawa factory to Tera Probe, INC.Reason for Change: To ensure stable supply and enhance competitiveness, Renesas back-end manufacturing factories are pursuing productivity improvements through process standardization, automation and specialization. As part of this initiative, the production line of the affected MCU products will be transferred to Tera Probe, INC.. Effective Date: 1/15/2027
Subject: Transfer of the Final Test, Visual Inspection and Packing production line for MCU productsDescription of Change: The Final Test, Visual Inspection and Packing production line for the affected MCU products will be transferred from Oita and Yonezawa factory to Tera Probe, INC.Reason for Change: To ensure stable supply and enhance competitiveness, Renesas back-end manufacturing factories are pursuing productivity improvements through process standardization, automation and specialization. As part of this initiative, the production line of the affected MCU products will be transferred to Tera Probe, INC.Effective Date: 1/15/2027
**UPDATE to FPCN113852**Description of Change: ?Applicable products: RX630/631/63N Group LFBGA-176 Package products?Assembly/Final test factory:Renesas Electronics Corporation Yonezawa Factory (?Yonezawa?)?Changes: Change to the wiring material and Mold resin materials.The materials to be changed are those that have been used in the Yonezawa assembly.Reason for Change: To ensure a stable supply and to improve productivity.Sample Availability Date: 10/1/2025
Description of Change: ?Applicable products: RX630/631/63N Group LFBGA-176 Package products ?Assembly/Final test factory:Renesas Electronics Corporation Yonezawa Factory (?Yonezawa?)?Changes: Change to the wiring material and Mold resin materials.The materials to be changed are those that have been used in the Yonezawa assembly.Reason for Change: To ensure a stable supply and to improve productivity.Sample Availability Date: 10/1/2025
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
