Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
PIC16F18115T-I/MD
Download the CAD models for this product. Learn more about SnapMagic.
3300 per Std. Mfr. Pkg
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: 8-Bit MicrocontrollersNotification Subject: Data Sheet - PIC16F18114/15/24/25/44/45 Full-Featured 8/14/20-Pin Microcontrollers Data SheetDescription of Change:Microchip has released a new Datasheet for the PIC16F18114/15/24/25/44/45 Full-Featured 8/14/20 Pin Microcontrollers Data Sheet of devices.Added characterization graphs; updated electrical specs; other minor corrections.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 03 Aug 2026
Product Category: 8-Bit MicrocontrollersNotification Subject: PIC16F18114/15/24/25/44/45 Silicon Errata and Data Sheet ClarificationsDescription of Change:Microchip has released a new Document for the PIC16F18114/15/24/25/44/45 Silicon Errata and Data Sheet Clarifications of devices. Updated data sheet revision letter to ‘D’; added silicon issues 1.7.1, 1.8.1, and 1.9.1Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 20 Jul 2026
*** Update of FPCN 117691 - Location and Material Change***Revision History: November 30, 2025: Issued initial notification.July 17, 2026: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 15, 2026.Product Category: 8-Bit MicrocontrollersDescription of Change: Qualification of MTAI as an additional assembly site for selected PIC16F15213, PIC16F15214, PIC16F17114, PIC16F17115, PIC16F18013, PIC16F18014, PIC16F18114 and PIC16F18115 device families available in 8L DFN (4x4x0.9mm) and 8L DFN (3x3x0.9mm) packages.Pre and Post Summary Changes: See atatched SPCN document for more detailsReason for Change: To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Estimated First Ship Date: 15 August 2026 (date code: 2633)
Description of Change: Qualification of MTAI as an additional assembly site for selected PIC16F15213, PIC16F15214, PIC16F17114, PIC16F17115, PIC16F18013, PIC16F18014, PIC16F18114 and PIC16F18115 device families available in 8L DFN (4x4x0.9mm) and 8L DFN (3x3x0.9mm) packages.Reason for Change: To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Estimated Qualification Completion Date: February 2026
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
UPDATE to Future PCN 113172Revision History:May 19, 2025: Issued initial notification. August 12, 2025: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on September 1, 2025. Updated the Notification subject and description of change to reflect additional bond wire instead of new bond wire. Updated the Pre and Post change table from 3280 to 3280NP die attach material.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire for selected PIC16F15213, PIC16F15214, PIC16F17114, PIC16F17115, PIC16F18013, PIC16F18014, PIC16F18114 and PIC16F18115 device families available in 8L DFN (3x3x0.9mm & 4x4x0.9mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as an additional wire material.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire for selected PIC16F15213, PIC16F15214, PIC16F17114, PIC16F17115, PIC16F18013, PIC16F18014, PIC16F18114 and PIC16F18115 device families available in 8L DFN (3x3x0.9mm & 4x4x0.9mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.Estimated Qualification Completion Date: June 2025
Microchip has released a new Document for the PIC16F18114/15/24/25/44/45 Silicon Errata and Data Sheet Clarifications of devices. If you are using one of these devices please read the document located at PIC16F18114/15/24/25/44/45 Silicon Errata and Data Sheet Clarifications.Notification Status: FinalDescription of Change: Added new silicon revision D2.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 02 April 2024
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
