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Manufacturer Part #
IPB107N20N3GATMA1
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1000 per Reel
TO-263-3 (D2PAK)
Surface Mount
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Subject:Capacity extension of wafer production and wafer test location to Infineon Technologies Sdn. Bhd., Kulim, Malaysia for dedicated OptiMOS™3 products. Description:OLD:- Infineon Technologies AG Regensburg, Germany- Infineon Technologies AG Regensburg, Germany- RUxxxxxx (Regensburg) NEW:- Infineon Technologies AG Regensburg, Germany- Infineon Technologies AG, Regensburg, Germany and Infineon Technologies Sdn. Bhd., Kulim, Malaysia - RUxxxxxx (Regensburg) and PFxxxxxx (Kulim) Reason : Introduction of additional Front-End Site to support continuous increasing customer demand Intended start of delivery : 2026-10-31
Detailed change informationSubject Extension of shelf lifetime from 3 to 5 years for products in SMD (Surface Mount Devices) and Leadless packagesReason Extension of shelf lifetime and product availabilityDescription Maximum storage timeOld - 3 years New- 5 yearsIntended start of delivery Immediately
Description of Change:Capacity extension of assembly and final test location to Infineon Technologies Tijuana, Mexico for dedicated products in TO263 package.Reason for Change:Extension of assembly and final test sites for additional capacity to ensure the continuity of supply and flexible manufacturing.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.