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SIZF906DT-T1-GE3
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3000 per Reel
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Vishay Siliconix Announces Manufacturing Capacity Expansion of BGBM Wafer Process for Commercial Power MOSFETs in PowerPAIR? PackagesDescription of Change: To meet increasing demand for commercial Power MOSFET products, Vishay Siliconix announces the qualification of wafer back-grind and back-metallization (BGBM) on select Commercial Power MOSFET in PowerPAIR? 3x3, PowerPAIR? 3x3FS, PowerPAIR? 6x5, and PowerPAIR? 6x5F packages at Prosperity Power Technology Inc.. ProPowertek, founded at the Hsinchu Science Park in Nov?20, aims to provide customers with engineering services for the center and backend wafer making process, and is devoted to leading the world in this market. ProPowertek is focusing on wafer thinning engineering, front side metal (FSM), backside grinding backside metal (BGBM), and IGBT back-end Turnkey solution in the local IC industry chain.
Description of Change: The wafer plating process for commercial power MOSFET products will move to a new building within the same Laguna Technopark. Classification of Change: In order to increase the capacity, Vishay Siliconix has moved the Philippines wafer plating facility in a larger building with the same equipment, same process, and same personnel.m Expected Influence on Quality/Reliability/Performance: There will be no effect on performance, quality or reliability and no change to form, fit, or function of the shipped devices.Vishay Brand(S): Vishay Siliconix Time Schedule: Start Shipment Date: Mon Feb 6, 2023
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.