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Manufacturer Part #
US3200005Z
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3000 per Reel
Shipping Information:
HTS Code:
ECCN:
PCN Information:
DESCRIPTION OF CHANGE:This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified additional Diodes internal A/T Site PCL located in Taoyuan City, Taiwan.The hermetic sealing process for the lid will change from a AuSn process in Faith Long AT to a Kovar process in PCL as described in Table 1A.Full electrical characterization and reliability testing have been completed on representative part numbers to ensure there is no change to product reliability, device functionality or electrical specifications in the datasheet unless specified.
DESCRIPTION OF CHANGE:This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified additional FAB Site (MXIC) located in Toufen, Taiwan. Diodes Internal A/T Site (SAT) located in Shanghai, China. Diodes internal FAB Site (SFAB2) located in Shanghai, China. Diodes Internal A/T Site (CAT) located in Chengdu, China. Diodes Internal wafer FAB Site (JKFAB) located in HsinChi, Taiwan.Diodes has also qualified an additional Bill of Materials (BOM) and Die Revision on select products. Lastly, the Tape and Reel Packing Quantity will be changed from 3000 units to 6000 units per reel for select products listed below.Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure no change to device functionality or electrical specifications in the datasheet unless specified in Table B.IMPACT:Continuity of Supply. There will be no change to the Form, Fit or Function of products affected, unless specifically indicated in Table A, B.PRODUCTS AFFECTEDTable 1 - Additional FAB Site (MXIC)Table 2 - Additional Assembly Test Site (SAT)Table 3 - Additional BOM - LID (See Table C)Table 4 - Additional FAB Site (SFAB2)Table 5 - Additional Assembly Test Site (CAT)Table 6 - Additional FAB Site (JKFAB)Table 7 - Additional Die Revision (Metal Only)Table 8 - Additional BOM ? SOP8 Die Attach (EN-4900GC), Mold Compound (CEL-9220HF13V)Table 9 - Additional Die Coat (Polyimide/ PIX-8144)Table 10 Additional BOM - TSSOP20 Die Attach (EN4900GC), Mold Compound (CEL-9220HF13V)Table 11 - Lead Length Change from Current (7.0mm) to New (5.0mm)Table 12 - Change to Packing Quantity of Tape and Reel (Current qty 3000, New qty 6000 per Reel)Table 13 - Additional BOM - Lead Frame (Etched Double Ring)Table 14 - Modify Datasheet (See Table B)
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
