Manufacturer Part #
8 Position 1.83 mm Height Surface Mount microSD Card Connector
|Mfr. Name:||Hirose Electric|
Hirose Electric DM3C-SF - Product Specification
Notification: Withdrawal of Process changeReason for the withdrawal :Regarding the process change, defect has occurred partially during an evaluation of changed-product.Currently, we are investigating the cause of the defect and considering an improvement method. However, since it requires some time, we decided to withdraw the process change for now to avoid any inconvenience due to stagnation. We will inform you again as soon as we are ready.
Notification: Withdrawal of Process change.This notification informs you a withdrawal of below process change, which was sent in March 2021.I Content of change:1. Addition of contact plating processing supplier2. Addition of sealing treatment due to the addition of plating processing supplier.3. Deletion of gold plating for contact that is not shown in drawingReason for the change: From the BCP perspective, plating processing supplier is added.2. Reason for the withdrawalRegarding the process change, defect has occurred partially during an evaluation of changed-product.Currently, we are investigating the cause of the defect and considering an improvement method.However, since it requires some time, we decided to withdraw the process change for now to avoid anyinconvenience due to stagnation. We will inform you again as soon as we are ready.
(1) Addition of contact plating company (2) Addition of sealing treatment solution due to addition of plating company (3)Elimination of gold plating for the parts not designated in the drawing of the contacts (1) Plating company: In addition to Company T, Company F will be added.(2) For the sealing treatment solution, in addition to Company T's "TD5900", Company F's "CT-3" will be added. (It differs by the plating company.) (3) The gold-plated area of the contact is only at the contacting part. (Refer to the attachment sheet) Except for the contacting part, it will only be the base Ni plating.
Production location for contact plating will be added.Sealing treatment solution will be changed due to the addition.There is no product design change. The plating thickness and application range will be changed within the standard range due to the addition of the plating production process.The sealing treatment solution on the contact surface will be changed at the added production location. Necessary evaluation test will be conducted.
Hirose Electric DM3C-SF - Technical Attributes
|Style/Orientation:||Right Angle Socket/Receptacle|
|No of Positions:||8|
|Mounting Method:||PCB Mount|