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Manufacturer Part #
S25FL128SAGMFI013
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1450 per Reel
SOIC-16
Surface Mount
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Description:Change of wire bond from Cu to CuPdAu for industrial graded SOIC 16L packaged productsReason:Product harmonization of bond wire usage. CuPdAu wire enables superior electrical, thermal and reliability performance, making it an excellent interconnect solution for packaging to ensure business continuity and supply by streamlining its production.LTB - 2025-05-12LTS - 2025-08-12
Description:The Cypress PCN204905 (PCN N? 2020-184-A), dated 2020-12-14 has been cancelled.Qualification of Amkor Assembly & Test (Shanghai) Co., Ltd. as an Additional Backend Test Site for Select Memory Solutions NOR Flash Products
Detailed change information:Change of lot naming convention in Infineon Technologies (Thailand) Limited, Nonthaburi, Thailand for subject memory productsReason:The lot numbering identification changing from 10 digit to 11 digit for whole Bangkok site according to the global Infineon standardlot numbering system manufacturing strategy.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.