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MCP6402T-E/MNY
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3300 per Reel
TDFN-8
Surface Mount
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Product Category: Linear Op Amps, Switching RegulatorsDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for MCP6061T-E/MNY, MCP6051T-E/MNY, MCP6071T-E/MNY, MCP6052TE/MNY, MCP6062T-E/MNY, MCP6072T-E/MNY, MCP6232T-E/MNY, MCP6402T-E/MNY, MCP6442T-E/MNY, MCP6V01T-E/MNY, MCP6V03T-E/MNY, MCP6V06T-E/MNY, MCP6V08TE/MNY, MCP6V26T-E/MNY, MCP6V28T-E/MNY, MCP621T-E/MNY, MCP651T-E/MNY, MCP631T-E/MNY, MCP661T-E/MNY, MCP16252T-I/MNY and MCP16251T-I/MNY catalog part numbers (CPN) available in 8L TDFN (2x3x0.8mm) package at MMT assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 23 September 2026 (date code: 2639)
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
****FPCN108254 UPDATE****Description of Change: Qualification of MMT as an additional assembly site for MCP6V03T-E/MNY, MCP6232T-E/MNY, MCP6V06T-E/MNY, MCP6V08T-E/MNY, MCP6V01T-E/MNY, MCP6052T-E/MNY, MCP6062T-E/MNY, MCP6402T-E/MNY, MCP6072T-E/MNY, MCP651T-E/MNY, MCP6051T-E/MNY, MCP6071T-E/MNY, MCP6061T-E/MNY, MCP661T-E/MNY, MCP6442T-E/MNY, MCP621T-E/MNY, MCP631T-E/MNY, MCP6V28T-E/MNY, MCP6V26T-E/MNY, MCP16251T-I/MNY, MCP16252T-I/MNY catalog part numbers (CPN) available in 8L TDFN (2x3x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change: Qualification of MMT as an additional assembly site for MCP6V03T-E/MNY, MCP6232T-E/MNY, MCP6V06T-E/MNY, MCP6V08T-E/MNY, MCP6V01T-E/MNY, MCP6052T-E/MNY, MCP6062T-E/MNY, MCP6402T-E/MNY, MCP6072T-E/MNY, MCP651T-E/MNY, MCP6051T-E/MNY, MCP6071T-E/MNY, MCP6061T-E/MNY, MCP661T-E/MNY, MCP6442T-E/MNY, MCP621T-E/MNY, MCP631T-E/MNY, MCP6V28T-E/MNY, MCP6V26T-E/MNY, MCP16251T-I/MNY, MCP16252T-I/MNY catalog part numbers (CPN) available in 8L TDFN (2x3x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Microchip has released a new Datasheet for the MCP6401 0.9uA, Rail-to-Rail Input/Output Op Amps of devices.Notification Status: FinalDescription of Change:1. Updated Section “Features” to specify AECQ100 qualifications.2. Updated 1.2 “MCP6401/1R/1U/2/4 Electrical Specifications” table.3. Updated Section 6.0 “Packaging Information”.4. Added Product Identification System (Automotive) section.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 29 Mar 2023
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
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