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Référence fabricant
MCP6L01T-E/OT
MCP6L01 Series 6 V 1 MHz Rail-to-Rail I/O Operational Amplifier - SOT-23-5
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-5 (SOT-25) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2527 | ||||||||||
Microchip MCP6L01T-E/OT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*** Update for PCN 113195 ***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected MCP111T, MCP60xx, MCP62xxx, MCP6401xx, MCP654xxx, MCP656xxx, MCP6G01xx, MCP6Lxxxx, TC1270ALxxx, TC1270AMxxx, TC1270ANxxx, TC1270ARxxx, TC1270ASxxx, TC1270ATxxx and TC1271Axxxx device families available in in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)Revision History: May 26, 2025: Issued final notification. June 3, 2025: Re-issued final notification to include Backside Coat material.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected MCP111T, MCP60xx, MCP62xxx, MCP6401xx, MCP654xxx, MCP656xxx, MCP6G01xx, MCP6Lxxxx, TC1270ALxxx, TC1270AMxxx, TC1270ANxxx, TC1270ARxxx, TC1270ASxxx, TC1270ATxxx and TC1271Axxxx device families available in in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6L01T-E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--amplifiers--general-purpose/mcp6l01t-e-ot-microchip-2032517
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6L01T-E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--amplifiers--general-purpose/mcp6l01t-e-ot-microchip-2032517
Microchip MCP6L01T-E/OT - Caractéristiques techniques
| Amplifier Type: | General Purpose |
| No of Channels: | 1 |
| Slew Rate-Nom: | 0.6V/µs |
| Input Offset Voltage-Max: | 5mV |
| Gain Bandwidth Product: | 1MHz |
| Average Bias Current-Max: | 2pA |
| Supply Voltage: | 1.8V to 6V |
| Common Mode Rejection Ratio: | 78dB |
| Supply Current: | 85µA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 83dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 105dB |
| Phase Margin: | 90° |
| Low Noise: | 24nV/√Hz |
| Output Current: | 20mA |
| Style d'emballage : | SOT-23-5 (SOT-25) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP6L01 series of single general purpose op amp offering rail-to-rail input and output over the 1.8 to 6 V operating range. This amplifier has a typical GBWP of 1 MHz with typical quiescent current of 85 microamperes. The MCP6L01 is available in SC-70 and SOT-23 packages
Features:
- 3 Gain Selections:
- +1, +10, +50 V/V
- One Gain Select Input per Amplifier
- Rail-to-Rail Input and Output
- Low Gain Error: ±1% (max.)
- High Bandwidth: 250 kHz to 900 kHz (typ.)
- Low Supply Current: 110 µA (typ.)
- Single Supply: 1.8 V to 5.5 V
- Extended Temperature Range: -40°C to +125°C
Applications:
- A/D Converter Driver
- Industrial Instrumentation
- Bar Code Readers
- Metering
- Digital Cameras
View the complete product family of MCP6L01 series Amplifiers
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-5 (SOT-25)
Méthode de montage :
Surface Mount