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Manufacturer Part #
BU22210MUV-E2
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3000 per Reel
Surface Mount
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Title of change: Change in wafer factory from ROHM Headquarters to LAPIS Miyagi and change in packaging materials and assembly factory due to production base reorganization.Description:Before change:Front-End Process: ROHM Headquarters0.18/0.13 CMOS 0.13 EEPROM. Back-End Process: See Attachment.After change:Front-End Process: LAPIS Miyagi 0.18/0.13 CMOS 0.13 EEPROM. Wire material change model for CMOS products features thicker pad metal. Back End Process: See Attachment.Reason for change: We will restructure low-utilization, small-scale production lines and standardize materials to advance structural reforms that ensure a stable supply to our customers over the long term.Planned first ship date September 30, 2026
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
