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Manufacturer Part #
MCP4706A0T-E/MAY
SINGLE, 8-BIT NV DAC WITH EXT VREF AND I2C INTERFACE
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:DFN-6 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP4706A0T-E/MAY - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP4706A0T-E/MAY&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--data-converters--digital-to-analog-converter/mcp4706a0t-e-may-microchip-2007660
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP4706A0T-E/MAY&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--data-converters--digital-to-analog-converter/mcp4706a0t-e-may-microchip-2007660
Microchip MCP4706A0T-E/MAY - Technical Attributes
| Interface: | I2C |
| No of Channels: | 1 |
| Resolution: | 8b |
| Supply Voltage: | 2.7V to 5.5V |
| Settling Time: | 6µs |
| On-Chip DAC: | 1-chx8-bit |
| Operating Temp Range: | -40°C to +125°C |
| Storage Temperature Range: | -65°C to +150°C |
| Moisture Sensitivity Level: | 1 |
| Package Style: | DFN-6 |
| Mounting Method: | Surface Mount |
Features & Applications
Features:
- Rail-to-Rail Output
- Fast Settling Time of 6 μs (typical)
- Nonvolatile Memory (EEPROM)
- Auto Recall of Saved DAC register setting
- Auto Recall of Saved Device Configuration (Voltage Reference, Gain, Power Down)
- Power-Down Modes
- Disconnects output buffer
- Selection of VOUT pull-down resistors (640 kΩ, 125 kΩ, or 1 kΩ)
- Low Power Consumption
- Normal Operation: 210 μA typ.
- Power Down Operation: 60 nA typ. (PD1:PD0 = “11”)
- I2C™ Interface:
- Eight Available Addresses
- Standard (100 kbps), Fast (400 kbps), and High-Speed (3.4 Mbps) Modes
- DAC Voltage Reference Options
- VDD
- VREF Pin
- Small 6-lead SOT-23 and DFN (2x2) Packages
- Extended Temperature Range: -40°C to +125°C
Applications:
- Set Point or Offset Trimming
- Sensor Calibration
- Low Power Portable Instrumentation
- PC Peripherals
- Data Acquisition Systems
- Motor Control
Available Packaging
Package Qty:
3000 per Reel
Package Style:
DFN-6
Mounting Method:
Surface Mount