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Manufacturer Part #
BU9794AKV-E2
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1000 per Reel
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Title of change Change in wafer factory from ROHM Headquarters to ROHM Apollo Chikugo and change in packaging materials due to production base reorganization.Detailed description of changeBeforeFront-End Process: ROHM Headquarters 0.35m CMOS.Back-End Process: See Attachment.AfterFront-End Process:ROHM Apollo Chikugo 0.35m CMOS.Wire material change models feature thicker PAD metal.Back-End Process: See Attachment.Reason for change We will restructure low-utilization, small-scale production lines and standardize materials to advance structural reforms that ensure a stable supply to our customers over the long term.Planned first ship date September 30, 2026Sample available schedule: March 2, 2026
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.