Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
MIC3203YM
Download the CAD models for this product. Learn more about SnapMagic.
95 per Tube
SOIC-8
Surface Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update of FPCN 119709 ***Revision History: March 11, 2026: Issued initial notification.August 04, 2026: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 02, 2026.Product Category: Automotive LED Drivers, General Purpose LED DriversDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for MIC3203-1YM, MIC3203YM, MAQ3203YM-VAO, MIC3203-1YM-TR, MIC3203YM-TR and MAQ3203YM-TRVAO catalog part numbers (CPN) available in 8L SOIC (3.90mm) package assembled at MTAI site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: 02 September 2026 (date code: 2636)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for MIC3203-1YM, MAQ3203YM-TRVAO, MAQ3203YM-VAO, MIC3203-1YM-TR, MIC3203YM and MIC3203YM-TR catalog part numbers (CPN) available in 8L SOIC (.150in) package assembled at MTAI site.*Initial Notification Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Estimated Qualification Completion Date: June 2026
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material for selected MIC2012, MIC2025, MIC2026, MIC2042, MIC2043, MIC2075, MIC2076, MIC2172, MIC2536, MIC2544, MIC2544A, MIC2545A, MIC2548, MIC2548A, MIC2549A, MIC2582, MIC2587, MIC29201, MIC29204, MIC2951, MIC2954, MIC3172, MIC3203, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC38HC42, MIC38HC43, MIC38HC44, MIC38HC45, MIC4223, MIC4224, MIC4225, MIC4801, MIC5014, MIC5015, MIC5020, MIC5021, MIC5156, MIC5200, MIC5201 and MIC5202 device families available in 8L SOIC (.150in) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material.
*** Update for PCN 111554 ***Revision History: March 19, 2025: Issued initial notification.December 17, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on January 14, 2026. Added column "Change (Yes/No)" in the pre and post change table. Updated part list to add 2A827 and MIC69303RTYME-HP_ASSY and remove MIC69303RTSGC-E, MIC69303RTSGC-MQ, MIC69303RTSGC-SV and MIC69303RTYME HP catalog part numbers (CPN). Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 161-699102, MAQ3203, MIC21xx, MIC22xx, MIC25xx, MIC32xx, MIC422x, MIC44Fxx, MIC682xx, MIC68400, MIC68401, MIC691xx, MIC6930, MIC69502, MIC79110 and MIC920 device families of 2AK (BCD12) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status: In ProgressEstimated First Ship Date: 14 January 2026 (date code: 2603)
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 161-699102, MAQ3203, MIC21xx, MIC22xx, MIC25xx, MIC32xx,MIC422x, MIC44Fxx, MIC682xx, MIC68400, MIC68401, MIC691xx, MIC6930, MIC69502, MIC79110 and MIC920 device families of 2AK (BCD12) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Part Status:
The MIC3203 is a hysteretic, step-down, constant-current, High-Brightness LED (HB LED) driver. It provides an ideal solution for interior/exterior lighting, architectural and ambient lighting, LED bulbs, and other general illumination applications.
The MIC3203 is well suited for lighting applications requiring a wide-input voltage range. The hysteretic control gives good supply rejection and fast response during load transients and PWM dimming. The high-side current sensing and on-chip current-sense amplifier delivers LED current with ±5% accuracy. An external high-side current-sense resistor is used to set the output current. The MIC3203 offers a dedicated PWM input (DIM) which enables a wide range of pulsed dimming. A high-frequency switching operation up to 1.5MHz allows the use of smaller external components minimizing space and cost. The MIC3203 offers frequency dither feature for EMI control. The MIC3203 operates over a junction temperature from -40 °C to +125 °C and is available in an 8-pin SOIC package. A dither disabled version MIC3203-1 is also available in the same package as the MIC3203.
Key Features:
Applications:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.