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Référence fabricant
TC4432COA
TC4432 Series 1.5 A 30 Vmax 7 Ohm Single High/Low Side MOSFET Driver - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip TC4432COA - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115157 ***Revision History: August 12, 2025: Issued initial notification. November 25, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on December 15, 2025. Added column "Change (Yes/No)" in the pre and post change tableDescription of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1404, MCP1406, MCP1407, MCP14E4, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4426A, TC4427, TC4427A, TC4429, TC4431, TC4432, TC4451 and TC4452 device families available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 15 December 2025 (date code: 2551)
*** Update for PCN 115290 ***Revision History: August 13, 2025: Issued initial notification.November 13, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 24, 2025.Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1403, MCP1404, MCP1405, MCP1406, MCP1407, MCP14E3, MCP14E4, MCP14E5, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC1426, TC1427, TC1428, TC426, TC427, TC428, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4425A, TC4426, TC4426A, TC4427, TC4427A, TC4428, TC4428A, TC4429, TC4431, TC4432, TC4451 and TC4452 available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 24 December 2025 (date code: 2552)
***UPDATE OF PCN110995, PCN111020, PCN116766***Revision History: February 20, 2025: Issued initial notification.February 21, 2025: Re-issued initial notification to update the qualification plan. October 17, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on November 20, 2025. October 23, 2025: Re-issued final notification to update pre and post change table to "wafer size". Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families of 40K and 42K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 20 November 2025 (date code: 2547)
***UPDATE OF PCN110995 & PCN111020***Revision History: February 20, 2025: Issued initial notification.February 21, 2025: Re-issued initial notification to update the qualification plan. October 17, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on November 20, 2025. Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families of 40K and 42K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiry.Estimated First Ship Date: 20 November 2025 (date code: 2547)
Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1403, MCP1404, MCP1405, MCP1406, MCP1407, MCP14E3, MCP14E4, MCP14E5, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC1426, TC1427, TC1428, TC426, TC427, TC428, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4425A, TC4426, TC4426A, TC4427, TC4427A, TC4428, TC4428A, TC4429, TC4431, TC4432, TC4451 and TC4452 available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated Qualification Completion Date: September 2025
Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1404, MCP1406, MCP1407, MCP14E4, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4426A, TC4427, TC4427A, TC4429, TC4431, TC4432, TC4451 and TC4452 device families available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: August 2025Revision History: February 20, 2025: Issued initial notification.February 21, 2025: Re-issued initial notification to update the qualification plan.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Microchip has released a new Datasheet for the 1.5A High-Speed 30V MOSFET Drivers Data Sheet of devices.Description of Change: ? Added AEC-Q100 Automotive Qualification to Features, General Description and examples in Product Identification System.? Updated Section 5.0 ?Packaging Information?.? Made minor formatting changes throughout the document.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 21 Dec 2022
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TC4432COA&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--drivers--mosfet-igbt-drivers/tc4432coa-microchip-9373663
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TC4432COA&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--drivers--mosfet-igbt-drivers/tc4432coa-microchip-9373663
Microchip TC4432COA - Caractéristiques techniques
| Configuration: | High and Low Side |
| No of Outputs: | Single |
| Output Impedance: | 7Ω |
| Peak Output Current: | 1.5A |
| Supply Voltage-Max: | 30V |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
It is suitable for high-side driver applications and will not latch-up under any conditions within their power and voltage ratings.
Features:
- Wide Input Supply Voltage Operating Range: 4.5 V to 30 V
- High Capacitive Load Drive Capability: 1000 pF in 25 nsec
- Short Delay Times – <78 nsec Typ.
- Low Supply Current:
- With Logic ‘1’ Input – 2.5 mA
- With Logic ‘0’ Input – 300 μA
- Latch-Up Protected: Will Withstand >300 mA Reverse Current
- ESD Protected – 4 kV
Applications:
- Small Motor Drive
- Power MOSFET Driver
- Driving Bipolar Transistors
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount