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Manufacturer Part #
BTN9970LVAUMA1
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2000 per Reel
Surface Mount
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Detailed Change Information:Subject:Change of silicon wafer diameter from 200mm to 300mm for products BTN99x0LV.Reason / Motivation:The 300 mm wafer manufacturing technology is the ,state of the art’ wafer manufacturing technology at Infineon. Therefore, the above mentioned products will be shifted from 200 mm wafer diameter to 300 mm wafer diameter.
Detailed change information:Subject: Update of Safety Application Note and Safety Package Release Note for BTN99**LV product family.Reason:Due to updated package and IC FIT rates, the base failure rates (BFR) and the FIT rates for the functional failure modes (FFM's) have been recalculated and modified in the Safety Application Note
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.