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MCP14T0517AT-E/CH
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3000 per
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Product Category: Isolated Gate DriversDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and Ag plated as a new lead-frame DAP surface prep for MCP14T0517AT-E/CH, MCP14T0517BT-E/CH, MCP14T0517AT-E/CHVAO and MCP14T0517BT-E/CHVAO catalog part numbers (CPN) available in 6L SOT-23 (1.6mm) package at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more details.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material and Ag plated as a new lead-frame DAP surface prep at MTAI assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: October 2026
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.