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Manufacturer Part #
HV2901K6-G
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260 per Tray
QFN-64
Surface Mount
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*** Update of FPCN 111841/LOCATION CHANGE/WAFER SIZ CHANGE ***Revision History: March 26, 2025: Issued initial notification. March 02, 2026: Issued final notification. Attached the qualification report. Added column "Change (Yes/No)" in the pre and post change table. Updated affected parts list to include HV2762LB-G catalog part number. Provided estimated first ship date to be on April 02, 2026. Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for the selected HV2802, HV2762, HV2662, HV2801, HV2661, HV2901, HV2902, HV2761, HV2733, HV2809, HV2722, HV2621, HV2721 and HV2808 device families of 6BK (A2) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 02 April 2026 (date code: 2614)
Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for the selected HV2802, HV2762, HV2662, HV2801, HV2661, HV2901, HV2902, HV2761, HV2733, HV2809, HV2722, HV2621, HV2721 and HV2808 device families of 6BK (A2) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
CCB 1409.13 Final Notice - Additional Fabrication Site: Qualification of an additional fabrication site for HV2661, HV2662, HV2733, HV2761, HV2762, HV2801, HV2802, HV2808, HV2809, HV2901 and HV2902Pre Change: Fabricated at SPTX fab site.Post Change: Fabricated at Microchip FAB2 fab siteNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
