
Manufacturer Part #
MCP16502TAC-E/S8B
PMIC FOR SAMA5DX/SAM9X6 MPUS
Product Specification Section
Microchip MCP16502TAC-E/S8B - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
File
Date
Material Change
07/23/2025 Details and Download
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Part Status:
Active
Active
Microchip MCP16502TAC-E/S8B - Technical Attributes
Attributes Table
Type: | Embedded System |
Supply Voltage: | 2.7V to 5.5V |
Operating Temp Range: | -40°C to +125°C |
Storage Temperature Range: | -65°C to +150°C |
Package Style: | VQFN-32 |
Mounting Method: | Surface Mount |
Pricing Section
Global Stock:
0
USA:
0
On Order:
0
Factory Lead Time:
4 Weeks
Quantity
Unit Price
3,300+
$2.69
Product Variant Information section
Available Packaging
Package Qty:
3300 per Reel
Package Style:
VQFN-32
Mounting Method:
Surface Mount