
Manufacturer Part #
MIC2810-4GPYML-TR
MIC2810 Series 5.5 V 2 MHz Surface Mount Digital Power Management IC - MLF-16
Microchip MIC2810-4GPYML-TR - Product Specification
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Description of Change: Qualification of UNIG as new assembly site for selected MIC2111xx, MIC2225, MIC2285A, MIC23150, MIC232xx, MIC2800, MIC28xx and MIC2821 device families available in various packages.Reason for Change: To improve manufacturability by qualifying UNIG as a new assembly site.Estimated First Ship Date: 16 April 2025 (date code: 2516)Revision History: November 23, 2023: Issued initial notification.March 07, 2025: Issued final notification. Attached Qualification Report. Revised affected parts list to remove MIC2111BYMT-T5 and MIC2111CYMT-T5 catalog part numbers due to EOL. Provided Estimated First Ship Date on April 16, 2025.
Description of Change:Qualification of UNIG as a new final test site for selected MIC200x, MIC201x, MIC28xx, Y30442D and MIC300x device families available in various packages using Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as new assembly site for selected MIC2111xx, MIC2225, MIC2285A, MIC23150, MIC232xx, MIC2800, MIC28xx and MIC2821 device families available in various packages.Reason for Change:To improve manufacturability by qualifying UNIG as a new assembly sitePre and Post Change Summary: See attached
Description of Change:Qualification of UNIG as a new final test site for selected MIC200x, MIC201x, MIC28xx, Y30442D and MIC300x device families available in various packages using Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Microchip has released a new Product Documents for the MIC2810 - Digital Power Management IC 2 MHz, 600 mA DC/DC with Dual 300 mA/300 mA Low VIN LDOs of devices.Notification Status: FinalDescription of Change: Updated package marking drawing in Section 5.1, Package Marking Information.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 21 Jan 2022
Part Status:
Microchip MIC2810-4GPYML-TR - Technical Attributes
Package Style: | MLF-16 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
5000 per Reel
Package Style:
MLF-16
Mounting Method:
Surface Mount