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MCP1703T-2802E/MB
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1000 per Reel
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*** Update of FPCN 110997 & 121804 ***Revision History: February 20, 2025: Issued initial notification.June 09, 2026: Issued final notification. Attached the qualification report. Added column Change X(Yes/No) in the pre and post change table. Provided estimated first ship date to be on September 30, 2026.June 17, 2026: Re-issued final notification. Updated the Number of Lots from 3 to 1 for ESD (CDM), ESD (HBM), and Latch-up tests and updated the Sample Size (per Lot) and Total samples for ESD (CDM) from 12 to 15, ESD (HBM) from 12 to 21, and Latch-up from 12 to 6.Product Category: Linear RegulatorsDescription of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP1702, MCP1703 and MCP1703A device families available in various packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2026 (date code: 2640)
***UPDATE OF PCN110997***Revision History: February 20, 2025: Issued initial notification.June 09, 2026: Issued final notification. Attached the qualification report. Added column "Change (Yes/No)" in the pre and post change table. Provided estimated first ship date to be on September 30, 2026Product Category: Linear RegulatorsNotification Subject: CCB 7364.011 Final Notice: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP1702, MCP1703 and MCP1703A device families available in various packages.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP1702, MCP1703 and MCP1703A device families available in various packages.Pre and Post Summary Changes: See attched SPCN document for more detailsReason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. Estimated First Ship Date: 30 September 2026 (date code: 2640)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP1702, MCP1703 and MCP1703A device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of GTBF as an additional assembly site for selected MCP11xT-xx, MCP170xT-xx, MCP170xRT-xx and MCP1703AT-xx device families available in 3L SOT-89 packageReason for Change:To improve on-time delivery performance by qualifying GTBF as an additional assembly site.
Revision History:August 30, 2023: Issued initial notification.September 7, 2023: Re-issued initial notification to remove MCP1700T-1802E/MBV05.January 23, 2024: Issued final notification. Updated post change paddle size from 71x79mils to 72x81mils and included backside coat details. Attached Qual Report and added the estimated first ship date on February 15, 2024.Description of Change:Qualification of GTBF as an additional assembly site for selected MCP11xT-xx, MCP170xT-xx, MCP170xRT-xx and MCP1703AT-xx device families available in 3L SOT-89 package.Reason for Change:To improve on-time delivery performance by qualifying GTBF as an additional assembly site.
Revision History:August 30, 2023: Issued initial notification.September 7, 2023: Re-issued initial notification to remove MCP1700T-1802E/MBV05.Description of Change:Qualification of GTBF as an additional assembly site for selected MCP11xT-xx, MCP170xT-xx, MCP170xRT-xx and MCP1703AT-xx device families available in 3L SOT-89 package.Reason for Change:To improve on-time delivery performance by qualifying GTBF as an additional assembly site.
Description of Change:Qualification of GTBF as an additional assembly site for selected MCP11xT-xx, MCP170xT-xx, MCP170xRT-xx and MCP1703AT-xx device families available in 3L SOT-89 package.Reason for Change:To improve on-time delivery performance by qualifying GTBF as an additional assembly site.
Microchip has released a new Datasheet for the MCP1703 - 250 mA, 16V, Low Quiescent Current LDO of devices.Notification Status: FinalDescription of Change: Revision includes:? Added automotive qualification to Features and examples to Product Identification System.? Made minor corrections.? Updated Section 7.0 ?Packaging Information? and Product Identification System.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 14 Sep 2022
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