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Manufacturer Part #
MCP1726-ADJE/MF
1A CMOS LDO, VOUT=0.08V, EXTENDED TEMP RANGE
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:120 per Tube Package Style:DFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP1726-ADJE/MF - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 111024 ***Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025Revision History:February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
Description of Change:Qualification of MMT as an additional assembly site for selected MCP1602, MCP1612, MCP1726, MCP1727, MCP622, MCP632, MCP652, MCP662, TC1301x and TC1302x device families available in 8L DFN (3x3x0.9mm) package.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Part Status:
Microchip MCP1726-ADJE/MF - Technical Attributes
| Input Voltage-Min: | 2.3V |
| Input Voltage-Max: | 6V |
| Output Voltage Range: | 0.8V to 5V |
| Output Voltage Fixed: | 0.8V/5V |
| Dropout Voltage-Max: | 500mV |
| Output Current-Max: | 1A |
| Rated Power: | 1.953W |
| Tolerance (%): | ±0.5% |
| Operating Temp Range: | -40°C to +125°C |
| Regulator Topology: | Adjustable |
| Quiescent Current: | 220µA |
| No. of Outputs: | Single |
| Output Noise: | 2µV |
| Load Regulation (%): | 1.5% |
| Line Regulation (%): | 0.3% |
| Package Style: | DFN-8 |
| Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
120 per Tube
Package Style:
DFN-8
Mounting Method:
Surface Mount