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MIC37100-2.5WS
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78 par Tube
SOT-223 (TO-261-4, SC-73)
Surface Mount
Informations de livraison:
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Code HTS:
ECCN:
Informations PCN:
Description of Change: Qualification of HANA as an additional assembly site for selected MIC2920A, MIC2954, MIC37100 and MIC39100 device families available in 3L SOT-223 package.Reason for Change: To improve on-time delivery performance by qualifying HANA as an additional assembly site.
UPDATE TO PCN 110887.Revision History: February 14, 2025: Issued initial notification.September 10, 2025: Issued final notification. Updated scope to remove MIC5200, MIC5201, MIC5202 device families and MIC5841YV-TR catalog part number and add 835-5043, LP2951, MIC2172, MIC2915x, MIC2920x, MIC2930xx, MIC2931x, MIC29371, MIC2941A, MIC29502, MIC2951, MIC2951x, MIC2954, MIC297xx, MIC2981, MIC3172, MIC37252, MIC37303, MIC3750x, MIC38C43, MIC38HC4x, MIC3915x, MIC3930x, MIC3950x, MIC3975, MIC457x, MIC501x, MIC502x, MIC5060, MIC515x, MIC580x and MIC58Pxx device families. Attached Qualification Report. Provided estimated first ship date to be on October 31, 2025.
***UPDATE OF PCN111394***Description of Change: Qualification of MTAI as an additional final test location for selected MIC5233, MIC2920A, MIC2954, MIC5200, MIC5201, MIC5209, MIC79050, MIC39100, MIC37100, and MIC5239 device families available in 3L SOT-223 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional final test location.Revision History:March 10, 2025: Issued initial notification.June 17, 2025: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on July 14, 2025. Updated affected CPN list to remove all Tape and Reel parts based on the updated scope. Updated the Pre and Post Change Summary Table and attached file.
Description of Change: Qualification of MTAI as an additional final test location for selected MIC5233, MIC2920A, MIC2954, MIC5200, MIC5201, MIC5209, MIC79050, MIC39100, MIC37100, and MIC5239 device families available in 3L SOT-223 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional final test location.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: September 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Statut du produit:
The MIC37100-2.5WS is a 1 A low-dropout, linear voltage regulator that provide low-voltage, high-current output from an extremely small package. Utilizing Micrel’s proprietary Super ßeta PNP™ pass element, the MIC37100/01/02 offers extremely low dropout (typically 280 mV at 1 A) and low ground current (typically 11 mA at 1 A).
The MIC37100 is a fixed output regulator offered in the SOT-223 package. The MIC37100/01/02 is ideal for PC add-in cards that need to convert from standard 5 V to 3.3 V, 3.3 V to 2.5 V or 2.5 V to 1.8 V or lower. A guaranteed maximum dropout voltage of 500 mV over all operating conditions allows the MIC37100/01/02 to provide 2.5 V from a supply as low as 3 V and 1.8 V from a supply as low as 2.3 V.
The MIC37100-2.5WS is fully protected with over current limiting and thermal shutdown. Fixed output voltages of 1.5 V, 1.65 V, 1.8 V, 2.5 V and 3.3 V are available on MIC37100/01 with adjustable output voltages to 1.24 V on MIC37102.
Key Features :
Applications :
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