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Manufacturer Part #
MIC5216-3.3YM5-TR
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3000 per Reel
SOT-23-5 (SOT-25)
Surface Mount
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PCN Information:
Product Category: Linear Regulators, Power Management - Power SwitchesNotification Subject: CCB 8023 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) as new bond wire material for selected MIC2013, MIC2014, MIC2090, MIC2003, MIC2004, MIC2005, MIC2005A, MIC2091, MIC5256, MIC5255, MIC5247, MIC5252, MIC5206, MIC5238, MIC5216 and MIC5317 device families available in 5L SOT-23 package at STAR assembly site.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as new bond wire material for selected MIC2013, MIC2014, MIC2090, MIC2003, MIC2004, MIC2005, MIC2005A, MIC2091, MIC5256, MIC5255, MIC5247, MIC5252, MIC5206, MIC5238, MIC5216 and MIC5317 device families available in 5L SOT-23 package at STAR assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as new bond wire material.Estimated Qualification Completion Date: October 2026
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
***UPDATE OF PCN110834***Description of Change: CCB 7364.004 Final Notice: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected LM4040, LM4041, MIC23158, MIC23159, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC4043, MIC4680, MIC4681, MIC4682, MIC4684, MIC4685, MIC4690, MIC5201, MIC5203, MIC5205, MIC5206, MIC5207, MIC5208, MIC5209, MIC5210, MIC5211, MIC5212, MIC5213, MIC5216, MIC5219, MIC5234, MIC5236, MIC5237, MIC5238, MIC5239, MIC5270, MIC5271, MIC6211, MIC6270, MIC79050, MM5450 and MM5451 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of G700 as a new mold compound material for selected Micrel MIC3490, MIC52xx, MIC62xxxM5, SPN020xxxx device families available in 5L SOT-23 package assembled at STAR assembly site.Reason for Change:To improve manufacturability by qualifying G700 mold compound material and DAP surface prep.Change Implementation Status:In ProgressEstimated First Ship Date:November 15, 2022 (date code: 2247)
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
