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MIC5365-2.8YMT-TZ
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10000 per Reel
TMLF-4
Surface Mount
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Product Category: Linear RegulatorsDescription of Change:Corrected typos in Functional Block Diagrams and Table 5-1. Updated TDFN references to UDFN instead throughout document. Updated Section 5.1 Package Marking Information with markings on back of TSOT option. Updated Package Drawings in Section 5.0 Packaging Information. Fixed voltage option details throughout Product Identification System page.Reason for Change: To Improve ProductivityDate Document Changes Effective: 28 Apr 2026
Product Category: Linear RegulatorsDescription of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for MIC5317, MIC5365, MIC5366, MIC5361, MIC5362, MIC5367, MIC5368, MIC5301, MIC5302, MIC5303 device families of 22K (CSI05) technology available in various packages.CHANGESFabrication Location:Pre Change- Microchip Technology Tempe ?Fab 2(TMGR)Post Change- Microchip Technology Colorado (MCSO)Wafer Size:Pre Change- 8" Post Change- 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. Estimated First Ship Date: 02 July 2026 (date code: 2627)*Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
*** Update for PCN 115457/MULTI CHANGE ***Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC5317, MIC5361, MIC5362, MIC5365, MIC5366 and MIC5376 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.Estimated Qualification Completion Date: January 2026Revision History: August 22, 2025: Issued initial notification.September 04, 2025: Re-issued initial notification to update die attached material from "ATB-F125E" to "CDF215".
Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC5317, MIC5361, MIC5362, MIC5365, MIC5366 and MIC5376 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.
Cancellation of Future PCN 113305.Revision History: May 30, 2025: Issued initial notification.August 15, 2025: Issued cancellation notification.CCB 7634 Cancellation Notice: For the qualification of ATP7 as an additional assembly site for selected MIC5362, MIC5361, MIC5376, MIC5317, MIC5366 and MIC5365 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Description of Change: For the qualification of ATP7 as an additional assembly site for selected MIC5362, MIC5361, MIC5376, MIC5317, MIC5366 and MIC5365 device families available in 4L UDFN (1.0x1.0x0.6mm) package.
***UPDATE OF PCN112765***Description:Qualification of STAR as an additional final test site and scan and pack site for selected MIC5504, MIC5361, MIC5362, MIC5365, MIC5317, MIC5366, MIC5502, MIC5524, MIC5503 and MIC5501 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.Revision History: May 07, 2025: Issued initial notification.June 19, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 28, 2025.
Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC5362, MIC5361, MIC5376, MIC5317, MIC5366 and MIC5365 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.Estimated Qualification Completion Date: December 2025
Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC5504, MIC5361, MIC5362, MIC5365, MIC5317, MIC5366, MIC5502, MIC5524, MIC5503 and MIC5501 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.