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MIC5503-1.8YMT-TR
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5000 per Reel
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*** Update of FPCN 115456, 115544,122551 - Location and Material Change***Revision History: August 22, 2025: Issued initial notification. August 26, 2025: Re-issued initial notification to update qualification plan. July 06, 2026: Issued final notification. Attached the Qualification Report. Added a Change (Yes/No) column and specified die attach material if PFAS affected or PFAS-free in the Pre and Post Change Summary table. Added "PFAS Elimination and Die Attach_Explanation" file. Provided estimated first ship date to be on August 01, 2026.July 09, 2026: Re-issued final notification to update the revision history last July 6, 2026 to remove revised the affected parts list as there is no update/revision to the affected CPN list.Product Category: Linear RegulatorsDescription of Change: Qualification of ATP7 as an additional assembly site for selected MIC5501, MIC5502, MIC5503, MIC5504, MIC5524 and MIC5528 device families available in 4L UDFN (1.0x1.0x0.6mm) and 6L UDFN (1.2x1.2x0.6mm) packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve on time delivery performance by qualifying ATP7 as an additional assembly site.Estimated First Ship Date: 01 August 2026 (date code: 2631)
*** Update of FPCN 115456, 115544 - Location and Material Change ***Revision History: August 22, 2025: Issued initial notification. August 26, 2025: Re-issued initial notification to update qualification plan. July 06, 2026: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Added a 'Change (Yes/No)' column and specified die attach material if PFAS affected or PFAS-free in the Pre and Post Change Summary table. Added PFAS Elimination and Die Attach_Explanation file. Provided estimated first ship date to be on August 01, 2026.Product Category: Linear RegulatorsDescription of Change: Qualification of ATP7 as an additional assembly site for selected MIC5501, MIC5502, MIC5503, MIC5504, MIC5524 and MIC5528 device families available in 4L UDFN (1.0x1.0x0.6mm) and 6L UDFN (1.2x1.2x0.6mm) packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve on time delivery performance by qualifying ATP7 as an additional assembly site.Estimated First Ship Date: 01 August 2026 (date code: 2631)
***UPDATE OF PCN115456***Revision History: August 22, 2025: Issued initial notification. August 26, 2025: Re-issued initial notification to update qualification plan. Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC5501, MIC5502, MIC5503, MIC5504, MIC5524 and MIC5528 device families available in 4L UDFN (1.0x1.0x0.6mm) and 6L UDFN (1.2x1.2x0.6mm) packages.Reason for Change: To improve on time delivery performance by qualifying ATP7 as an additional assembly site.Estimated Qualification Completion Date: January 2026
Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC5501, MIC5502, MIC5503, MIC5504, MIC5524 and MIC5528 device families available in 4L UDFN (1.0x1.0x0.6mm) and 6L UDFN (1.2x1.2x0.6mm) packages.Reason for Change: To improve on time delivery performance by qualifying ATP7 as an additional assembly site.
***UPDATE OF PCN112765***Description:Qualification of STAR as an additional final test site and scan and pack site for selected MIC5504, MIC5361, MIC5362, MIC5365, MIC5317, MIC5366, MIC5502, MIC5524, MIC5503 and MIC5501 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.Revision History: May 07, 2025: Issued initial notification.June 19, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 28, 2025.
Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC5504, MIC5361, MIC5362, MIC5365, MIC5317, MIC5366, MIC5502, MIC5524, MIC5503 and MIC5501 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.
Microchip has released a new Datasheet for the MIC5501/2/3/4 - 300mA Single Output LDO in Small Packages of devices. Notification Status: FinalDescription of Change:? Replaced the TDFN package type with UDFN throughout the document.? Updated the package drawings within Section 7.0 ?Packaging Information?.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 27 Mar 2024
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