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Manufacturer Part #
MIC94325YMT-TR
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5000 per Reel
TDFN-6
Surface Mount
Shipping Information:
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PCN Information:
*** Update of FPCN 113167 & 115991 - Location and Material Change ***Revision History: May 19, 2025: Issued initial notification.September 11, 2025: Re-issued initial notification to update the die attach material from ATB-F125E to CDF215.June 26, 2026: Issued final notification. Added the "Change (Yes/No)" column to the Pre- and Post- Change Summary table. Updated the Pre- and Post- Change attachment. Attached the qualification report. Provided estimated first ship date to be on July 30, 2026. Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC94355, MIC94305, MIC94325 and MIC94345 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve on-time delivery performance by qualifying ATP7 as an additional assembly siteEstimated First Ship Date: 30 July 2026 (date code: 2631)
Description of Change:Revision History• Removed Obsolete devices from Table 5-1.• Updated Product Identification System:-Added a list of Obsolete devices.-Removed the 1.2V Output Voltage option.Reason for Change: To Improve ProductivityDate Document Changes Effective: 18 May 2026
**** Update for PCN 113167/LOCATION AND MATERIAL CHANGE****Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC94355, MIC94305, MIC94325 and MIC94345 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Reason for Change: To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.Estimated Qualification Completion Date: November 2025Revision History: May 19, 2025: Issued initial notification.September 11, 2025: Re-issued initial notification to update the die attach material from ATB-F125E to CDF215.
*** Update for PCN 112974 ***Revision History: May 13, 2025: Issued initial notification.July 23, 2025: Issued final notification. Attached Qualification Report. Provided estimated first ship date to be on July 31, 2025.Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC94345, MIC2095, MIC2097, MIC2098, MIC2099, MIC23030, MIC23031, MIC2791, MIC5265, MIC5301, MIC5304, MIC5308, MIC5309, MIC5318, MIC5320, MIC5321, MIC5322, MIC5335, MIC5353, MIC5367, MIC5368, MIC5370, MIC5371, MIC5512, MIC5514, MIC826, MIC841, MIC94305, MIC94325 and MIC94355 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.Estimated First Ship Date: 31 July 2025 (date code: 2531)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC94355, MIC94305, MIC94325 and MIC94345 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Reason for Change: To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.Estimated Qualification Completion Date: November 2025
Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC94345, MIC2095, MIC2097, MIC2098, MIC2099, MIC23030, MIC23031, MIC2791, MIC5265, MIC5301, MIC5304, MIC5308, MIC5309, MIC5318, MIC5320, MIC5321, MIC5322, MIC5335, MIC5353, MIC5367, MIC5368, MIC5370, MIC5371, MIC5512, MIC5514, MIC826, MIC841, MIC94305, MIC94325 and MIC94355 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Microchip has released a new Datasheet for the 500 mA LDO with Ripple Blocker Technology of devices.Description of Change: Changed all references to Thin DFN or TDFN throughout data sheet to Ultra Thin DFN or UDFN. Updated package outline drawings to correct UDFN PODs. Minor text and format changes throughout.Reason for Change: To improve productivity.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
