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Manufacturer Part #
MCP9701A-E/TO
MCP9701A Series 5.5 V Low-Power Linear Active Thermistor - TO-92-3
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Bag Package Style:TO-92 Mounting Method:Through Hole | ||||||||||
| Date Code: | 2311 | ||||||||||
Microchip MCP9701A-E/TO - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 111024 ***Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025Revision History:February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
Microchip has released a new Datasheet for the MCP9700-Family-Data-Sheet-DS20001942 of devices. Notification Status: FinalDescription of Change:The following is the list of modifications:1. Updated Table DC Electrical Characteristics.2. Updated Section 5.0 “Packaging Information” with Automotive elements.3. Updated the Product Identification System section. Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 10 Mar 2023
Microchip has released a new Datasheet for the Low-Power Linear Active Thermistor ICs of devices.Notification Status: FinalDescription of Change:1. Updated Table DC Electrical Characteristics.2. Updated Section 5.0 “Packaging Information” with Automotive elements.3. Updated the Product Identification System section.Impacts to Data Sheet: See above details.Change Implementation Status: CompleteDate Document Changes Effective: 28 Feb 2023
Revision History:November 04, 2021: Issued initial notification.March 15, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on April 20, 2022. Updated the package lay-out in Pre and Post change comparison (ppt file) for CRTK ? Die sit either flat side or curve side depending on die or BD lay-out on some devices.Description of Change:Qualification of CEL-8240 GS as a new mold compound material for selected Supertex CL2xx, CL52xx, LND150, MCP15xx, MCP170x and MCP970xx device families available in 3L TO-92 package assembled at CRTK assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying CEL-8240 GS as a new mold compound material at CRTK assembly site.
Part Status:
Microchip MCP9701A-E/TO - Technical Attributes
| Output Type: | Analog |
| Supply Voltage: | 3.1V to 5.5V |
| Operating Temp Range: | -40°C to +125°C |
| Output Current-Max: | 100µA |
| Package Style: | TO-92 |
| Mounting Method: | Through Hole |
Features & Applications
Available Packaging
Package Qty:
1000 per Bag
Package Style:
TO-92
Mounting Method:
Through Hole
