Manufacturer Part #
DSI30-08AS-TRL
Power Diode Discretes-Rectifier TO-263D2
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| Mfr. Name: | Littelfuse - IXYS | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:800 per Reel Package Style:TO-263-3 (D2PAK) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2441 | ||||||||||
Littelfuse - IXYS DSI30-08AS-TRL - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description:This is a notification letter to inform you that we are improving our Moisture Sensitivity Level (MSL) to MSL 1 for various IXYS Brand Thyristor & Diode Discrete surface mount packages. Package types includes: TO-263(D2PAK), TO-268(D3PAK) All affected IXYS Brand Thyristors & Diode Discrete surface mount products have been fully qualified following established performance and reliability criteria using alternative EMC (PCN # ESW490-58). Below and succeeding pages summarize the reliability result and change in the packing method.Form, fit, function changes : Updated MSL 1 packing methodEffective date : Feb 28th, 2025
Littelfuse would like to notify you that we have qualified alternative Epoxy Molding Compound (EMC) material for various IXYS Brand Thyristor & Diode Discrete Packages to serve the Business Continuity Plan (BCP).Package types includes : TO-262, TO-3P, TO-247, SOT227, TO-268, TO-263, TO-220.All affected IXYS Brand Thyristor & Diode Discrete products have been fully qualified in accordance with established performance and reliability criteria using alternative EMC. The attached pages summarized the qualification results. Full qualification data and/or samples will be available upon request.Form, fit, function changes: No Fit/Form/Function change with alternative EMC.Effective date: August 10th, 2024
This is a updated declaration letter associated to ESW490-40 - IXYS Thy & Diode I4Pac&GUFP Package; ESW490-44 - IXYS Thy & Diode TO247_ISO247_PLUS247_ISOPLUS247Package; ESW490-47 - IXYS Thy & Diode SOT-227 Package; PCN # ESW490-48 ? IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer. Littelfuse will change the MOQ/MDQ/DU for IXYS Power Thyristor & Diode products aligning to manufacture requirement.
This is a updated declaration letter associated to ESW490-40 - IXYS Thy & Diode I4Pac&GUFP Package; ESW490-44 -IXYS Thy & Diode TO247_ISO247_PLUS247_ISOPLUS247Package; ESW490-47 - IXYS Thy & Diode SOT-227 Package; PCN # ESW490-48 ? IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer. Littelfuse will change the MOQ/MDQ/DU for IXYS Power Thyristor & Diode products aligning to manufacture requirement. Detail affected part number list refer to Appendix.
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
Littelfuse would like to notify you that we will transfer our backend assembly process of IXYS Power Thyristor & Diode products TO263 Package to our new inhouse assembly factory in Lipa, Philippines. This brand-new assembly factory is to fulfill our strategy to invest in state-of-the-art power semiconductor assembly capabilities to dramatically improve our service levels to customers. Our target is to build this factory as a world class facility with automated, error proof processes to meet the highest quality standards. Contact our local Sales team in case you would like to understand more about this new factory. Below is the detail changes associate with this Assembly Location change: 1) Silicon Die: No change 2) Backend Assembly Bill of Materials: No change 3) Backend Assembly Process Flow: No change 4) Backend Assembly Equipment: Equal or better 5) Marking & Labeling: Yes.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=Asia&field16=en&field2=DSI30-08AS-TRL&field4=Littelfuse - IXYS&field18=https://p1apac.futureelectronics.com/p/semiconductors--discretes--diodes--fast-rectifiers/dsi30-08as-trl-littelfuse-%E2%80%93-ixys-5120054
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=Asia&field16=en&field2=DSI30-08AS-TRL&field4=Littelfuse - IXYS&field18=https://p1apac.futureelectronics.com/p/semiconductors--discretes--diodes--fast-rectifiers/dsi30-08as-trl-littelfuse-%E2%80%93-ixys-5120054
Littelfuse - IXYS DSI30-08AS-TRL - Technical Attributes
| Package Style: | TO-263-3 (D2PAK) |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
800 per Reel
Package Style:
TO-263-3 (D2PAK)
Mounting Method:
Surface Mount