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Manufacturer Part #
MSC2X31SDA170J
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10 per Tube
SOT-227-4
Chassis Mount
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PCN Information:
Reason for Change: To improve productivity by implementing top marking change.Description of Change:Implement top marking change for selected MSC035SMA170J-MOSFET, MSC015SMA070J-MOSFET, MSC0xxSMA120J-MOSFET, MSC080SMA120JS15-MOSFET, MSC2X100SDA070J-Diode, MSC2X100SDA120J-Diode, MSC2X101SDA070J-Diode, MSC2X101SDA120J-Diode, MSC2X30SDAxxxJ-Diode, MSC2X31SDAxxxJ-Diode, MSC2X50SDAxxxJ-Diode and MSC2X51SDAxxxJ-Diode device families available in 4L SOT-227 package.
Description of Change:Implement packing material changes for selected PSDS and SIC products available in SOT-227, TO-220, TO-247, TO-263 and TO-268 packages at FSTS and TEAM final test sites.Reason for Change:To improve productivity by implementing packing material changes for selected PSDS and SIC products.
***June 27, 2024: Re-issued final notification. Updated the affected parts list to include CPN MSC035SMA070BV01 based on the updated scope***Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Revision History:February 26, 2024: Issued initial notification.May 24, 2024: Issued final notification. Revised the affected parts list. Provided estimated first ship date to be on June 29, 2024.Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Revision History:September 20, 2022: Issued initial notification.May 3, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on May 30, 2023.PCN Type:Manufacturing Change Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as an additional fabrication site for selected 1700V SiC Schottky Barrier Diode (SBD) products of MSC010SDA170xx, MSC030SDA170xx, MSC050SDA170xx, MSC2X3xSDA170J, and MSC2X5xSDA170J device families available in die sales products, 2L TO-247, and 4L SOT-227 packages.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity and on-time delivery performance by qualifying MCSO as an additional fabrication site.Change Implementation Status:In ProgressEstimated First Ship Date:May 30, 2023 (date code: 2322)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
PCN Status:Final NotificationDescription of Change:Implement top marking changes for selected PSDS (Power Switching Discrete Solutions) Silicon Carbide (SiC) Products available in TO-247, TO-263, TO-268, TO-220 and SOT-227 packages.Reason for Change:To improve productivity by standardizing the top marking as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated First Ship Date:March 31, 2023 (date code: 2313)
PCN Status:Final NotificationPCN Type:Manufacturing ChangeMicrochip Parts Affected:Please open one of the files found in the Affected CPNs section.Note: For your convenience Microchip includes identical files in two formats (.pdf and .xls)Description of Change:Implement Microchip Inner Labels and documentation changes for selected PSDS (Power Switching Discrete Solutions) Silicon Carbide (SiC) Products.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by standardizing the packing method as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated First Ship Date:February 17, 2023 (date code: 2307)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
PCN Status:Initial NotificationDescription of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as an additional fabrication site for selected 1700V SiC Schottky Barrier Diode (SBD) products of MSC010SDA170xx, MSC030SDA170xx, MSC050SDA170xx, MSC2X3xSDA170J, and MSC2X5xSDA170J device families available in die sales products, 2L TO-247, and 4L SOT-227 packages.Reason for Change:To improve productivity and on-time delivery performance by qualifying MCSO as an additional fabrication site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.