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Manufacturer Part #
APTGLQ40H120T1G
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1 per Tube
SP-1
Through Hole
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PCN Information:
Product Category: High Voltage Power ModulesDescription of Change: Qualification of INFG as an additional fabrication site for selected APT25GLxx, APT40GLxx, APTGL1xx, APTGL24xx, APTGL32xx, APTGL4xx, APTGL60xx, APTGL70xx, APTGL87xx, APTGL90xx, APTGLQxx, APTLGL3xx, CMADGL1xx, CMANGLQxx, CMAOGLQxx, CMBBGLQxx, CMIEGLQxx, CMLRGLxx, CMMGGLQxx, CMMIGLQxx, CMMISM1xx, CMMVGLQxx, CMRMGL1xx, CMSBGLQxx, CMTFGLQxx, CMZRGLQxx, MSCGLxx, and MSCSM12xx device families available in 1200V IGBT4 Bare Die ProductsReason for Change: To improve on-time delivery performance by qualifying INFG as an additional fabrication site.Estimated First Ship Date: 26 May 2026 (date code: 2622)
Microchip has released a new Errata for the SP1 to SP1F Module Package Data Sheet Clarification Errata of devices. If you are using one of these devices please read the document located at SP1 to SP1F Module Package Data Sheet Clarification Errata.Notification Status: FinalDescription of Change: Added SP1F package schematic images.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 03 November 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Revision History:January 17, 2023: Issued initial notification.February 23, 2023: Re-issued initial notification to add the catalog part number APTDR90X1601G to the affected CPN list as part of the scope.August 8, 2023: Issued final notification. Attached the Qual report and included the estimated first ship date on August 29, 2023.Description of Change:Qualification of MP3B as a new assembly site for selected Microsemi products available in SP1 package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MP3B as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:August 29, 2023 (date code: 2335)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Microchip has released a new Errata for the SP1 to SP1F Module Package Update Errata of devices. Notification Status: FinalDescription of Change: Initial releaseImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 26 Jul 2023
PCN Status:Initial NotificationDescription of Change:Qualification of MP3B as a new assembly site for selected Microsemi products available in SP1 package.Reason for Change:To improve on-time delivery performance by qualifying MP3B as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2023
Description of Change:Qualification of MP3B as a new assembly site for selected Microsemi products available in SP1 package.Reason for Change:To improve on-time delivery performance by qualifying MP3B as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2023
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
