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IMZA65R027M1HXKSA1
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30 per
TO-247-4
Through Hole
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Subject : Capacity extension of assembly and final test location to ATX Semiconductor (Weihai) Co. Ltd., China for dedicated products in TO247-4L package Description:Old Tongfu Microelectronics Co., Ltd.,China (TFME) New Tongfu Microelectronics Co., Ltd.,China (TFME) ATX Semiconductor (Weihai) Co. Ltd., China (ATX WH) Reason: Extension of assembly and final test sites for additional capacity to ensure the continuity of supply and flexible manufacturing Intended start of delivery 2026-08-24
Subject CoolSiCTM 650V G1 SiC datasheets revision updatesReason: (1) Naming and nomenclature update according to IEC 60747-8 Amd.1 Ed.3.03 from 2020(2) Update Tj,max from 150?C to 175?C for the following products:IMW65R027M1H, IMW65R048M1H,IMW65R072M1H,IMW65R107M1H,IMZA65R027M1H, IMZA65R048M1H,IMZA65R072M1H and IMZA65R107M1H(3) Extend the VGS(static) and VGS(dynamic) specs of products reported in Table 1 in TO247-3pin and TO247-4pin package.(4) Datasheet template harmonization with respect to CoolSiCTM MOSFET 650V G2
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.