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Manufacturer Part #
SUP70030E-GE3
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50 per Tube
TO-220-3 (TO-220AB)
Through Hole
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Description of Change: To meet the increasing demand for commercial Power MOSFET products, Vishay Siliconix announces the qualification of wafer BGBM process (Backside-Grind and Backside-Metallization) for commercial Low-Voltage Power MOSFETs at in-house Siliconix Philippines Inc.(SPI) facility in Binan, Philippines.Reason for Change: Capacity Expansion
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.