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VP2110K1-G-D537
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3000 per Reel
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Product Category: Depletion Mode Mosfets, N-Channel Enhancement Mode Mosfets, P-Channel Enhancement Mode MosfetsNotification Subject: CCB 8332 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for 2N7002-G, DN1509T-V/C6X, DN3135K1-G, LND150K1-G, LND250K1-G, TN2106K1-G, TN2124K1-G, TN2124K1-G-D545, TN2130K1-G, TN5325K1-G, TN5335K1-G, TN5335K1-G-D589, TP0610T-G, TP2104K1-G, TP5322K1-G, TP5335K1-G, TP5335K1-G-AAA, TP5335K1-G-D588, VN2110K1-G, VP2110K1-G and VP2110K1-G-D537 catalog part numbers (CPN) available in 3L SOT-23 (1.3mm) package at MTAI assembly site.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for 2N7002-G, DN1509T-V/C6X, DN3135K1-G, LND150K1-G, LND250K1-G, TN2106K1-G, TN2124K1-G, TN2124K1-G-D545, TN2130K1-G, TN5325K1-G, TN5335K1-G, TN5335K1-G-D589, TP0610T-G, TP2104K1-G, TP5322K1-G, TP5335K1-G, TP5335K1-G-AAA, TP5335K1-G-D588, VN2110K1-G, VP2110K1-G and VP2110K1-G-D537 catalog part numbers (CPN) available in 3L SOT-23 (1.3mm) package at MTAI assembly site.Pre and Post Summary Changes:See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MTAI assembly site.Estimated Qualification Completion Date: August 2026
*** Update for PCN 111842 /Location Change***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication site for multiple device families of DMOS2.5 (63K, 6K, 6FK, 6GK, 6HK) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 08 October 2025 (date code: 2541)Revision History: March 26, 2025: Issued initial notification. September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 08, 2025.
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication site for multiple device families of DMOS2.5 (63K, 6K, 6FK, 6GK, 6HK) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025
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